Patterned film effects on the adhesion of Al/TiN barrier using fracture-energy based finite element analysis

► Interfacial adhesion of TiN/Al films is predicted and verified by simulations and analytical solutions. ► Fracture energy of dissimilar materials is simulated based on J-integral method and VCCT. ► Mode-I of fracture modes is dominant in the adhesive measurement of 4-PBT. ► Pattern effect of metal lines on fracture energy of TiN/Al interface is investigated. ► Dielectrics with low modulus underneath TiN/Al interface have a capability to arrest crack growth.