Influence of crystallite size and lattice spacing on thermal conduction of polycrystalline copper deposited by solid particle impingement: Contribution of electron and phonon conduction

► Dense copper coating by severe plastic deformation process ► Crystallite size was refined up to 30 nm via the dynamic recrystallization. ► Decrease of crystallite boundary eliminates the interruption of thermal conduction. ► Distorted lattice structure can be changed back to a strain-free state via annealing.