Effect of Cu addition on properties of Ti-Al-Si-N nanocomposite films deposited by cathodic vacuum arc ion plating

► Ti-Al-Si-N films doped with various Cu contents were deposited by arc ion plating. ► The films are composed of nano-crystalline TiAlN, Cu and amorphous Si3N4. ► Friction coefficient decrease with increasing copper content. ► Adhesive strength increase with increasing copper content.