Ni and Ti diffusion barrier layers between Ti-Si-C and Ti-Si-C-Ag nanocomposite coatings and Cu-based substrates

► Investigation of Cu diffusion barriers in Ti-Si-C based nanocomposite contacts. ► Sputtered Ni or Ti layers combined with Ti-Si-C-Ag coatings can hinder Cu diffusion. ► Cu diffusion can be hindered combining electroplated Ni with Ti-Si-C or Ti-Si-C-Ag.