| کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن | 
|---|---|---|---|---|
| 8037653 | 1518287 | 2018 | 28 صفحه PDF | دانلود رایگان | 
عنوان انگلیسی مقاله ISI
												A consistent full-field integrated DIC framework for HR-EBSD
												
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																																												کلمات کلیدی
												
											موضوعات مرتبط
												
													مهندسی و علوم پایه
													مهندسی مواد
													فناوری نانو (نانو تکنولوژی)
												
											پیش نمایش صفحه اول مقاله
												 
												چکیده انگلیسی
												A general, transparent, finite-strain Integrated Digital Image Correlation (IDIC) framework for high angular resolution EBSD (HR-EBSD) is proposed, and implemented through a rigorous derivation of the optimization scheme starting from the fundamental brightness conservation equation in combination with a clear geometric model of the Electron BackScatter Pattern (EBSP) formation. This results in a direct one-step correlation of the full field-of-view of EBSPs, which is validated here on dynamically simulated patterns. Strain and rotation component errors are, on average, (well) below 10â5 for small (Eeq=0.05%) and medium (Eeq=0.2%) strain, and below 3Ã10â5 for large strain (Eeq=1%), all for large rotations up to 10° and 2% image noise. High robustness against poor initial guesses (1° misorientation and zero strain) and typical convergence in 5 iterations is consistently observed for, respectively, image noise up to 20% and 5%. This high accuracy and robustness rivals, when comparing validation on dynamically simulated patterns, the most accurate HR-EBSD algorithms currently available which combine sophisticated filtering and remapping strategies with an indirect two-step correlation approach of local subset ROIs. The proposed general IDIC/HR-EBSD framework lays the foundation for future extensions towards more accurate EBSP formation models or even absolute HR-EBSD.
											ناشر
												Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Ultramicroscopy - Volume 191, August 2018, Pages 44-50
											Journal: Ultramicroscopy - Volume 191, August 2018, Pages 44-50
نویسندگان
												T. Vermeij, J.P.M. Hoefnagels,