کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9638257 | 505049 | 2005 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Development of a copper alloy to beryllium HIP bonding technology for the ITER first wall
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی انرژی
مهندسی انرژی و فناوری های برق
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چکیده انگلیسی
The primary first wall (PFW) panels of the ITER blanket concept comprise a bi-metallic copper alloy/stainless steel water-cooled heatsink faced with a plasma facing material. Precipitation strengthened CuCrZr is one option for the copper alloy of the heatsink; beryllium, in the form of tiles is an option for the plasma facing material. Over recent years, the technology needed to HIP bond the beryllium tiles to CuCrZr alloy has been developed. This paper describes small samples and larger mock-ups produced during the development of this HIP bonding technology and outlines how structural analyses were used to gain an understanding of the bonding process and refine the design.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Fusion Engineering and Design - Volumes 75â79, November 2005, Pages 377-381
Journal: Fusion Engineering and Design - Volumes 75â79, November 2005, Pages 377-381
نویسندگان
P. Sherlock, A.T. Peacock, A.D. Mc Callum,