کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
9793698 1514277 2005 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Cladding technique for development of Ag-In-Cd decoupler
موضوعات مرتبط
مهندسی و علوم پایه مهندسی انرژی انرژی هسته ای و مهندسی
پیش نمایش صفحه اول مقاله
Cladding technique for development of Ag-In-Cd decoupler
چکیده انگلیسی
To develop a Ag (silver)-In (indium)-Cd (cadmium) alloy decoupler, a method is needed to bond the decoupler between two plates of the Al alloy (A6061-T6). We found that a better HIP condition was temperature, pressure and holding time at 803 K, 100 MPa and 1 h, respectively, for small test pieces (ϕ 22 mm in diam. × 5 mm in height). Especially, a sandwich case (a Ag-In plate with thickness of 0.5 mm between two Ag-Cd plates with thickness of 1.25 mm) gave easier (or better) bonding results. Though a hardened layer is found in the bonding layer, the rupture strength of the bonding layer is more than 30 MPa, which is higher than the design stress in our application.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Nuclear Materials - Volume 343, Issues 1–3, 1 August 2005, Pages 154-162
نویسندگان
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