IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate

In the ball shear test, the shear strength value did not change much as a function of reflow time. In all samples, the fracture occurred in the bulk solder. The results of interfacial reaction and shear test in this study show that the Sn-Ag-Cu/Ni BGA solder joint has a desirable joint reliability.