کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9809580 | 1517712 | 2005 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Electroless copper seed layer deposition on tantalum nitride barrier film
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Electroless (EL) deposition is used as a seeding technology for Cu metallization in the back-end-of-line semiconductor fabrication process. In this work, effect of deposition time and annealing treatment on the properties of electroless copper seed layer are reported. It is found that all seed layers exceeding 2-min deposition possess a (111) texture. The grain size, morphology and resistivity of the electroless Cu vary with deposition time. The largest grain size obtained by current work is around 70 nm. This corresponds to the lowest resistivity of 4.30 μΩ cm. The surface roughness of as-deposited Cu films ranges from 36.6 to 51.9 nm. Annealing results in the growth of copper grains and improvement in surface roughness and film conductivity. The annealing treatment does not change the existing texture.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 198, Issues 1â3, 1 August 2005, Pages 287-290
Journal: Surface and Coatings Technology - Volume 198, Issues 1â3, 1 August 2005, Pages 287-290
نویسندگان
S.P. Chong, Y.C. Ee, Z. Chen, S.B. Law,