کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9952396 | 1450513 | 2018 | 15 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs](/preview/png/9952396.png)
چکیده انگلیسی
The main aim of this paper is to present the methodology for calculating the applicability range of the Dual-Phase-Lag model in integrated circuits (IC) made of different materials. Furthermore, analyses of requirements for using the Dual-Phase-Lag instead of the Fourier-Kirchhoff heat transfer model are described. All considerations are based on a transistor elementary cell including FinFETs in modern ICs. The obtained results have been analyzed in detail and compared. Moreover, the paper shows an important correction to the Neumann boundary condition required for consistency with the Dual-Phase-Lag equation. In addition, the simplified Dual-Phase-Lag model has also been presented in this paper. It is based on both the classical Fourier-Kirchhoff methodology and Dual-Phase-Lag approach. However, significant improvements related to time lags approximation have been proposed. This simplified model can be implemented in Finite Difference Method and Finite Element Method simulators based on two conjugate diffusion equations. Finally, the temperature distribution inside one- and three-dimensional FinFET structures has been determined based on Fourier-Kirchhoff and Dual-Phase-Lag models.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 91, Part 1, December 2018, Pages 139-153
Journal: Microelectronics Reliability - Volume 91, Part 1, December 2018, Pages 139-153
نویسندگان
Mariusz Zubert, Tomasz Raszkowski, Agnieszka Samson, Piotr ZajÄ
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