Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives Fulltext Access 7 Pages 2005
Case study: Network intrusion investigation - lessons in forensic preparation Fulltext Access 7 Pages 2005
Tracking USB storage: Analysis of windows artifacts generated by USB storage devices Fulltext Access 7 Pages 2005
Reliability challenges for copper low-k dielectrics and copper diffusion barriers Fulltext Access 7 Pages 2005
Electroluminescence spectroscopy for reliability investigations of 1.55 μm bulk semiconductor optical amplifier Fulltext Access 7 Pages 2005
New experimental approach for failure prediction in electronics: Topography and deformation measurement complemented with acoustic microscopy Fulltext Access 7 Pages 2005
Dc and low frequency noise analysis of hot-carrier induced degradation of low complexity 0.13 μm CMOS bipolar transistors Fulltext Access 7 Pages 2005
An investigation of electrical and structural properties of Ni-germanosilicided Schottky diode Fulltext Access 7 Pages 2005
Size effects on the DC characteristics and low frequency noise of double polysilicon NPN bipolar transistors Fulltext Access 7 Pages 2005
Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing Fulltext Access 7 Pages 2005
Determination of self-heating and thermal resistance in polycrystalline and bulk silicon resistors by DC measurements Fulltext Access 7 Pages 2005
Biological sequence alignment on the computational grid using the GrADS framework Fulltext Access 7 Pages 2005
Solving multidimensional 0-1 knapsack problem by P systems with input and active membranes Fulltext Access 7 Pages 2005
Constant time fault tolerant algorithms for a linear array with a reconfigurable pipelined bus system Fulltext Access 8 Pages 2005
Multiuser 3D virtual simulation environments support in the Gnutella peer-to-peer network Fulltext Access 8 Pages 2005
Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E Fulltext Access 8 Pages 2005
Characterisation of a new hump-free device structure for smart power and embedded memory technologies Fulltext Access 8 Pages 2005
An FPGA implementation of the AES-Rijndael in OCB/ECB modes of operation Fulltext Access 8 Pages 2005
Efficient parametric yield optimization of VLSI circuit by uniform design sampling method Fulltext Access 8 Pages 2005
The impact of PMOST bias-temperature degradation on logic circuit reliability performance Fulltext Access 8 Pages 2005
Characterization of interface defects related to negative-bias temperature instability in ultrathin plasma-nitrided SiON/Siã1Â 0Â 0ã systems Fulltext Access 8 Pages 2005
Effects of inhomogeneous negative bias temperature stress on p-channel MOSFETs of analog and RF circuits Fulltext Access 8 Pages 2005
Impact of negative bias temperature instability on digital circuit reliability Fulltext Access 8 Pages 2005
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers Fulltext Access 8 Pages 2005
Substrate current and degradation of n-channel polycrystalline silicon thin-film transistors Fulltext Access 8 Pages 2005
An investigation on the relation between digital circuitry characteristics and power supply noise spectrum in mixed-signal CMOS integrated circuits Fulltext Access 8 Pages 2005
New trim configurations for laser trimmed thick-film resistors-theoretical analysis, numerical simulation and experimental verification Fulltext Access 8 Pages 2005
Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package) Fulltext Access 8 Pages 2005
Methods of discovery and exploitation of Host Protected Areas on IDE storage devices that conform to ATAPI-4 Fulltext Access 8 Pages 2005
Chemical mechanical polishing of polycarbonate and poly methyl methacrylate substrates Fulltext Access 8 Pages 2005
Polarisability of a confined multisubband electron gas with exchange and correlation interactions Fulltext Access 8 Pages 2005
Low-cost test technique using a new RF BIST circuit for 4.5-5.5Â GHz low noise amplifiers Fulltext Access 8 Pages 2005
Analysis of surface contamination on organosilicate low k dielectric materials Fulltext Access 8 Pages 2005
Non-destructive high-resolution characterization of buried interfaces for advanced interconnect and packaging architectures: Experiments and modeling Fulltext Access 8 Pages 2005
Origins of debris and mitigation through a secondary RF plasma system for discharge-produced EUV sources Fulltext Access 8 Pages 2005
Challenges in the implementation of low-k dielectrics in the back-end of line Fulltext Access 8 Pages 2005
First-principle calculations on gate/dielectric interfaces: on the origin of work function shifts Fulltext Access 8 Pages 2005
Advantages of HfAlON gate dielectric film for advanced low power CMOS application Fulltext Access 8 Pages 2005
Investigating physical and chemical changes in high-k gate stacks using nanoanalytical electron microscopy Fulltext Access 8 Pages 2005
Novel fabrication process to realize ultra-thin (EOTÂ =Â 0.7 nm) and ultra-low-leakage SiON gate dielectrics Fulltext Access 8 Pages 2005
Fabrication of submicron- or nano-sized mesa electrodes via AFM oxidation: Applications to metal ion detection Fulltext Access 8 Pages 2005
Erbium photoluminescence in opal matrix and porous anodic alumina nanocomposites Fulltext Access 8 Pages 2005
Optical properties of treated and untreated monocrystalline p-Siã1Â 1Â 1ã, p-Siã1Â 0Â 0ã, n-Siã1Â 1Â 1ã and n-Siã1Â 0Â 0ã wafers in the visible region at room temperature Fulltext Access 8 Pages 2005
Interfacial reactions and joint reliability of Sn-9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate Fulltext Access 8 Pages 2005
Characterization and optimization of a new Cu/SiN/TaN/Cu damascene architecture for metal-insulator-metal capacitors Fulltext Access 8 Pages 2005
Dual damascene ash development for a VFTL of target k = 2.0 integration Fulltext Access 8 Pages 2005
Deposition of silver, indium, and magnesium onto organic semiconductor layers: Reactivity, indiffusion and metal morphology Fulltext Access 8 Pages 2005
Study of anisotropic conductive adhesive joint behavior under 3-point bending Fulltext Access 8 Pages 2005
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly Fulltext Access 8 Pages 2005
Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs Fulltext Access 8 Pages 2005
Molecular structures on crystalline metallic surfaces - From STM images to molecular electronics Fulltext Access 8 Pages 2005
100 μm Pitch flip chip on foil assemblies with adhesive interconnections Fulltext Access 8 Pages 2005
Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides Fulltext Access 8 Pages 2005
Optimal topology control for balanced energy consumption in wireless networks Fulltext Access 8 Pages 2005
Effect of process parameters on material removal rate in chemical mechanical polishing of Si(1Â 0Â 0) Fulltext Access 8 Pages 2005
Charge trapping in MOSFETs with HfSiON dielectrics during electrical stressing Fulltext Access 8 Pages 2005
Collective optical behavior in complementary wire arrays with Au nanoparticles Fulltext Access 8 Pages 2005
A disposable capillary electrophoresis microchip with an indium tin oxide decoupler/amperometric detector Fulltext Access 8 Pages 2005
The mechanism of the ion beam inhibited etching formation in Gallium-FIB implanted resist films Fulltext Access 8 Pages 2005