Keywords: سرمازدایی; P; hydrostatic pressure [N/m2]; R1, R2; principal radii of curvature [m]; γ; surface energy density [J/m2], equals surface tension [N/m]; p; radius of contact pad [m]; j; p/K, the ratio of bond pad radius to undeformed bump height [-]; K; height of bump
مقالات ISI سرمازدایی (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps
Keywords: سرمازدایی; Solder bump; Intelligent diagnosis; LM-BP algorithm; SAM inspection;
Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm
Keywords: سرمازدایی; Fuzzy SVM algorithm; Defect inspection; Solder bump; Scanning acoustic microscopy;
Using active thermography and modified SVM for intelligent diagnosis of solder bumps
Keywords: سرمازدایی; Solder bump; Active thermography; Support vector machine; Intelligent inspection; Classification;
Defects inspection of the solder bumps using self reference technology in active thermography
Keywords: سرمازدایی; Solder bump; Defects inspection; Self reference; Source distribution image
Impact strength of Sn–3.0Ag–0.5Cu solder bumps during isothermal aging
Keywords: سرمازدایی; Lead-free solder; Solder bump; Impact test; Joint strength; Fracture morphology; Isothermal aging
Thermo-mechanical analysis of TSV and solder interconnects for different Cu pillar bump types
Keywords: سرمازدایی; Through silicon via; Pillar bump; Solder bump; Von Mises stress;
Thermal conduction analysis and characterization of solder bumps in flip chip package
Keywords: سرمازدایی; Flip chip; Solder bump; Defects; Heat transfer; Thermal resistance
X-ray absorption-based technique to measure the thickness of multi-layered structures
Keywords: سرمازدایی; X-ray absorption-based technique; Thickness measurements; Solder bump; Gray values; Multi-layered structures
A novel bumping process for fine pitch Sn–Cu lead-free plating-based flip chip solder bumps
Keywords: سرمازدایی; Flip chip; Solder bump; Fine pitch; Electroplating; Polishing
Experiences in flip chip production of radiation detectors
Keywords: سرمازدایی; 29.40.ân; 82.47.Wx; Flip chip; Solder bump; Yield; Pixel detector;
The evaluation of mechanical stresses developed in underlying silicon substrates due to electroless nickel under bump metallization using synchrotron X-ray topography
Keywords: سرمازدایی; 62.20.âx; 61.72.Ff; 07.10.Pz; 85.40.Sz; 85.40.âe; 85.40.Ls; 89.20.+a; 61.10.Yh; 65.70.+y; 68.35.Ct; 68.35.Gy; Electroless Ni(P) deposition; Under-bump metallization (UBM); Strain; Electronic packaging; Reliability; Solder bump; X-ray topography;