The effect of tricyclazole as a novel leveler for filling electroplated copper microvias

Tricyclazole (TCA), a nitrogen-containing heterocyclic compound, is employed as potential leveler for filling electroplated copper microvias. The TCA exhibits excellent filling performance due to the strong donor-acceptor interaction between TCA and the copper surface thanks to the formation of Cu(I)TCA complex or polymeric complexes.579