کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
10268671 459675 2011 10 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Influence of the substrate's surface structure on the mechanism and kinetics of the electrochemical UPD formation of a copper monolayer on gold
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی مهندسی شیمی (عمومی)
پیش نمایش صفحه اول مقاله
Influence of the substrate's surface structure on the mechanism and kinetics of the electrochemical UPD formation of a copper monolayer on gold
چکیده انگلیسی
► Cu UPD was studied onto different gold substrates, Au(1 1 1) and polycrystalline gold. ► Experimental potentiostatic current density transients were recorded in this system. ► j-t plots were analyzed using existing theoretical models. ► Formation of the Cu monolayer follows the same mechanism in both cases. ► Mechanism involves simultaneous presence of Cu adsorption and 2D nucleation.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Electrochimica Acta - Volume 56, Issue 27, 30 November 2011, Pages 10083-10092
نویسندگان
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