Electrodeposition of Co-Ni and Co-Ni-Cu systems in sulphate-citrate medium

The presence of very low copper(II) concentrations (<10−2 mol dm−3) in the nickel-cobalt bath makes it possible to incorporate copper in the deposits in amounts ranging from 5 to 60% Cu, although uniform deposits are obtained only for low copper percentages. These ternary deposits are solid solutions with fcc structure and magnetic behaviour both dependent on the deposition potential.