کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10364783 | 871819 | 2005 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Process integration of Pr-based high-k gate dielectrics
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Process integration of Pr-based high-k gate dielectrics Process integration of Pr-based high-k gate dielectrics](/preview/png/10364783.png)
چکیده انگلیسی
We present the process integration of the Pr-based high-k oxides Pr2O3, PrTixOy and PrxSiyOz for CMOS devices. MOS structures were grown in form of p+ poly-Si/Pr-based dielectric/Si(100) by MBE. RIE with CF4/O2 plasma was used to selectively remove the poly-Si layer. It was found that the Pr-based oxides layers can be dissolved with high selectivity in diluted H2SO4 solutions. Details of the etch kinetics of Pr-based oxides and poly-Si were studied. Electrical characteristics of MOS stacks with integrated PrxSiyOz are presented.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 82, Issue 2, October 2005, Pages 148-153
Journal: Microelectronic Engineering - Volume 82, Issue 2, October 2005, Pages 148-153
نویسندگان
A.U. Mane, Ch. Wenger, G. Lupina, T. Schroeder, G. Lippert, R. Sorge, P. Zaumseil, G. Weidner, J. Dabrowski, H.-J. Müssig,