Silver-cemented frit formation for the stabilization of the packing structure in the microchannel of electrochromatographic microchips

► We demonstrate new approach for the frit structure formation at the ends of the silica-packed microchannel on a CEC microchip. ► It was formed by controlled soaking of the silica packing in Ag(NH3)2+ solution followed by formaldehyde reduction. ► Rigorous erosion test proved the stability of the frit structure and packing in the microchannel. ► Extension of the lifetime of the microchip for CEC separation was possible with this treatment.