The chemical and dielectric properties of epoxy/(Ba0.8Sr0.2)(Ti0.9Zr0.1)O3 composites for embedded capacitor application

The characteristics of epoxy/(Ba0.8Sr0.2)(Ti0.9Zr0.1)O3 (BSTZ) composites are investigated for the further application in embedded capacitor device. The effects of BSTZ ceramic powder filler ratio on the chemical, physical and dielectric properties of epoxy/BSTZ composites are studied. Differential scanning calorimeter (DSC) thermal analysis is conducted to determine the optimum values of hardener agent, curing temperature, reaction heat, and glass transition temperature (Tg). The hardener reaction process starts at about 115 °C and completes at about 200 °C, for that it is appropriate to process of epoxy/BSTZ composites in the range of temperature. The highest glass transition temperature (Tg) of 155 °C is obtained at one equivalent weight ratio (hardener/epoxy). Only the BSTZ phase can be detected in the XRD patterns of epoxy/BSTZ composites. The more BSTZ ceramic powder is mixed with epoxy, the higher crystalline intensity of tetragonal BSTZ phase are revealed in the XRD patterns. The dielectric constant measured at 1 MHz increases from 5.8 to 23.6 as the content of BSTZ ceramic powder in the epoxy/BSTZ composites increases from 10 to 70 wt%. The loss tangents of the epoxy/BSTZ composites slightly increase with the increase of measurement frequency.