Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling

► Damage mechanism of realistic Flip Chip Solder joints (FCSJs) is investigated. ► FCSJs high-temperature reliability is modelled using Anand's visco-plasticity. ► Very thin and very thick thicknesses of IMC impact FCSJ reliability. ► Solder strain controlled studies with strain range lower than 0.12 is inadequate to simulate FCSJ's damage. ► Accumulated FCSJ damage is dependent on percentage of IMC and solder in joint.