Keywords: تراشه تلنگر; Flip chip; No-flow; Viscous; Misalignment; Self-alignment; Solder wetting dynamics;
مقالات ISI تراشه تلنگر (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: تراشه تلنگر; Back propagation network; Defect inspection; Flip chip; Genetic algorithm; Vibration analysis;
Keywords: تراشه تلنگر; Anisotropic conductive adhesive; Reliability; Humidity; Flip chip; Thin chips; Finite element modelling;
Using GA-SVM for defect inspection of flip chips based on vibration signals
Keywords: تراشه تلنگر; Flip chip; Defect inspection; Genetic algorithms (GA); Support vector machine (SVM); Vibration signal;
Nondestructive diagnosis of flip chips based on vibration analysis using PCA-RBF
Keywords: تراشه تلنگر; Flip chip; Nondestructive diagnosis; Principal component analysis; Radial basis function; Vibration analysis;
Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding
Keywords: تراشه تلنگر; Thermo-compression bonding; Flip Chip; Piezoresistive; Advanced packaging; Warpage; Tilt; Au bumps; Reliability; Interconnect; Thermal gradient;
Corrosion testing of anisotropic conductive adhesive interconnections on FR4, liquid crystal polymer and polyimide substrates
Keywords: تراشه تلنگر; Anisotropic conductive adhesive; Flip chip; Salt spray test; Corrosion; Polyimide; Liquid crystal polymer; FR4
Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process
Keywords: تراشه تلنگر; Lattice Boltzmann method; Flip chip; Encapsulation; Micro-voids;
Using RBF networks for detection and prediction of flip chip with missing bumps
Keywords: تراشه تلنگر; Flip chip; Defect recognition; Prediction; Vibration analysis; RBF networks
Using BP network for ultrasonic inspection of flip chip solder joints
Keywords: تراشه تلنگر; Flip chip; Back-propagation network; Defect inspection; Ultrasonic inspection
Thermal conduction analysis and characterization of solder bumps in flip chip package
Keywords: تراشه تلنگر; Flip chip; Solder bump; Defects; Heat transfer; Thermal resistance
High temperature reliability of lead-free solder joints in a flip chip assembly
Keywords: تراشه تلنگر; Power electronics; High temperature electronics; Flip chip; Pb-free solder; Intermetallic compound; Microelectronics reliability; Fatigue failures; Solder joint
Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling
Keywords: تراشه تلنگر; High-temperature electronics; Inter-metallic compounds; Lead-free solder; Flip chip; Solder joint reliability; Solder joint damage;
A novel approach for flip chip solder joint inspection based on pulsed phase thermography
Keywords: تراشه تلنگر; Flip chip; Solder joints; Inspection; Pulsed phase thermography
Effect of multiple reflows on interfacial reaction and shear strength of Sn–Ag electroplated solder bumps for flip chip package
Keywords: تراشه تلنگر; Flip chip; Sn–Ag; Intermetallic compound (IMC); Interfacial reaction; Shear test
FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process
Keywords: تراشه تلنگر; Underfill; Flip chip; Capillary flow; Finite volume; Computational fluid dynamics (CFD); Volume of fluid
The law of ultrasonic energy conversion in thermosonic flip chip bonding interfaces
Keywords: تراشه تلنگر; Flip Chip; Dynamics; Diffusion
Formation and assembly of carbon nanotube bumps for interconnection applications
Keywords: تراشه تلنگر; Carbon Nanotubes; Flip Chip; Interconnects; Joining
Transmission property of flip chip package with adhesive interconnection for RF applications
Keywords: تراشه تلنگر; Radio frequency; Flip chip; Anisotropic conductive film; Non-conductive film; Interconnect
Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au
Keywords: تراشه تلنگر; Au-20Sn solder; Flip chip; Interfacial reaction; Electroplating; Bump shear test;
Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints
Keywords: تراشه تلنگر; Sn–37Pb; Sn–3.0Ag–0.5Cu; Flip chip; Interfacial reaction; Shear force
Flip chip microassembly of a silicon triaxial force sensor on flexible substrates
Keywords: تراشه تلنگر; MEMS; Microassembly; Anisotropic film; Bonding; Flip chip
Mesomechanical modelling of SnAgCu solder joints in flip chip
Keywords: تراشه تلنگر; 61.72.Bb; 62.20.F-; 65.40.De; 85.40.BhSnAgCu Solder; Crystal mechanics; Flip chip; Finite elements
Junction temperature and reliability of high-power flip-chip light emitting diodes
Keywords: تراشه تلنگر; 68.60.Dv; 85.35.BeJunction temperature; High power; Flip chip; Infrared micro-imaging; Finite element method; Electrode pattern
Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process
Keywords: تراشه تلنگر; Anisotropic conductive film; Flip chip; Reflow; Chip on flex
Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method
Keywords: تراشه تلنگر; Flip chip; Interfacial reaction; Stencil printing; Bump shear test; Joint reliability
Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies
Keywords: تراشه تلنگر; Fatigue; Flip chip; Solder joint; Lead free
A novel bumping process for fine pitch Sn–Cu lead-free plating-based flip chip solder bumps
Keywords: تراشه تلنگر; Flip chip; Solder bump; Fine pitch; Electroplating; Polishing
Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation
Keywords: تراشه تلنگر; Crystal visco-plasticity; SnAgCu solder; Flip chip; Sub-model; Finite elements
High density of electrodeposited Sn/Ag bumps for flip chip connection
Keywords: تراشه تلنگر; Flip chip; Solder bumping; Eutectic Sn–Ag
Time–temperature transformation (TTT) cure diagram of a fast cure non-conductive adhesive
Keywords: تراشه تلنگر; Gelation; Vitrification; TTT cure diagram; Non-conductive adhesive; Flip chip
Investigations of the test parameters and bump structures in the shear test of flip chip solder bump
Keywords: تراشه تلنگر; Optimization; Flip chip; Solder; Finite element analysis
Evaluation of solder joint reliability in flip chip package under thermal shock test
Keywords: تراشه تلنگر; Flip chip; Thermal shock test; Reliability; Finite element analysis
A new COP bonding using non-conductive adhesives for LCDs driver IC packaging
Keywords: تراشه تلنگر; Flip chip; Fine pitch; Non-conductive adhesives; Plastic substrate; Thermal cycling
Experiences in flip chip production of radiation detectors
Keywords: تراشه تلنگر; 29.40.ân; 82.47.Wx; Flip chip; Solder bump; Yield; Pixel detector;
Flip chip bumping technology—Status and update
Keywords: تراشه تلنگر; Packaging; Flip chip; Bumping; Electroplating
EVOLUTION OF MICROSTRUCTURE OF Sn-Ag-Cu LEAD-FREE FLIP CHIP SOLDER JOINTS DURING AGING PROCESS
Keywords: تراشه تلنگر; lead free solder; flip chip; aging;
Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection
Keywords: تراشه تلنگر; Flip chip; Anisotropic conductive film; Bonding pressure; Reliability
Microcontacts with sub-30 μm pitch for 3D chip-on-chip integration
Keywords: تراشه تلنگر; 3D Interconnect; Inter metallic compound (IMC); Solder balls; Flip chip; System in package (SiP), Lead free, Solid
Exploration of the metrological performance of a gas detector based on an array of unspecific infrared filters
Keywords: تراشه تلنگر; NDIR; Optical gas detection; Thermopile; Thin films filters; Flip chip; Component correction; Drift
Characterisation of electroplated Sn/Ag solder bumps
Keywords: تراشه تلنگر; Flip chip; Bumping; Sn/Ag; AES; EDS; Fine pitch
Reliability evaluations of flip chip package under thermal shock test
Keywords: تراشه تلنگر; Flip chip; Thermal shock test; Thermal fatigue; Solder; Sn-37Pb;
Evaluation of lead-free SnAg solder ball deposition and reflow processes for flip chip applications
Keywords: تراشه تلنگر; SnAg electroplating; Flip chip; Reflow; Soldering; Pattern plating; Shear strength; Binary;
Optimization of shear test for flip chip solder bump using 3-dimensional computer simulation
Keywords: تراشه تلنگر; Flip chip; Shear height; Shear speed; Finite element analysis;
Measurements of deformations and strains of a Si-epoxy-FR4 structure during thermal testing
Keywords: تراشه تلنگر; Moiré interferometry; Thermal testing; Deformation; Strain; Creep; Flip chip;
Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM
Keywords: تراشه تلنگر; Sn-3.0Ag-0.5Cu; Flip chip; Interfacial reaction; Finite element modeling; Shear test;
Solid state interfacial reaction and joint strength of Sn-37Pb solder with Ni-P under bump metallization in flip chip application
Keywords: تراشه تلنگر; Sn-37Pb; Flip chip; Interfacial reaction; Finite element modeling; Shear test;