Investigations of the test parameters and bump structures in the shear test of flip chip solder bump

Shear test for flip chip solder bump was investigated in terms of shear height and shear speed with an experimental and non-linear 3-dimensional finite element analysis. It could be observed that increasing shear height, at a fixed shear speed, has the effect of decreasing shear force, while the shear force increased with increasing shear speed at a fixed shear height. From the experimental and computational results, low shear height and low shear speed could be recommended for the shear test of the flip chip solder bumps. The shear test method was applied to investigate the effect of bump geometries on the shear force of the solder joints. The shear force increased with increasing height of Cu mini bump.