کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1572280 | 1000676 | 2010 | 7 صفحه PDF | دانلود رایگان |
![عکس صفحه اول مقاله: Depressing effect of 0.1 wt.% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging Depressing effect of 0.1 wt.% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging](/preview/png/1572280.png)
In this paper, the effect of 0.1 wt.% Cr addition into Sn–9Zn lead-free solder alloys on the growth of intermetallic compound (IMC) with Cu substrate during soldering and subsequent isothermal aging was investigated. During soldering, it was found that 0.1 wt.% Cr addition did not contribute to forming the IMC, which was verified as the same phase structure as the IMC for Sn–9Zn/Cu. However, during solid-state isothermal aging, the IMC growth was remarkably depressed by 0.1 wt.% Cr addition in the Sn–9Zn solder, and this effect tended to be more prominent at higher aging temperature. The activation energy for IMC growth was determined as 21.2 kJ mol− 1 and 42.9 kJ mol− 1 for Sn–9Zn/Cu and Sn–9Zn–Cr/Cu, respectively. The reduced diffusion coefficient was confirmed for the 0.1Cr-containing solder/Cu. Energy-dispersive X-ray mapping and point analysis also showed ZnCr phase existing in solder matrix, which can reduce diffusion rate of Zn atoms.
Journal: Materials Characterization - Volume 61, Issue 3, March 2010, Pages 355–361