کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1611049 | 1516291 | 2014 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 μm Sn–Ag–Cu solder bumps
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 μm Sn–Ag–Cu solder bumps Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 μm Sn–Ag–Cu solder bumps](/preview/png/1611049.png)
چکیده انگلیسی
Synchrotron radiation real-time imaging technology was used to in situ study the dissolution and precipitation behavior of Ag3Sn plates in sub-50 μm Sn–4.0Ag–0.5Cu flip chip solder bumps on Ni–P under bump metallization (UBM). The dissolution rate of large Ag3Sn plates was as slow as 0.1–0.2 μm/s at the heating stage, while the precipitation rate exceeded 5 μm/s at the cooling stage with an undercooling of 31–55 °C. The random precipitation behavior of Ag3Sn plates was in situ observed and explained from the perspective of cluster. This study shows an effective method to investigate the microstructural evolution and the undercooling of phases in real ultra-fine solder joints.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 602, 25 July 2014, Pages 281–284
Journal: Journal of Alloys and Compounds - Volume 602, 25 July 2014, Pages 281–284
نویسندگان
M.L. Huang, F. Yang, N. Zhao, Y.C. Yang,