Solidification and solid state phenomena during TLP bonding of IN718 superalloy using Ni-Si-B ternary filler alloy

► Microstructure evolution during TLP bonding of IN718 using Ni-Si-B filler. ► Athermal solidification path is influenced by severe segregation of B and Si in residual liquid. ► High hardness of ASZ microconstituents necessitates designing a PBHT to avert brittleness. ► Diffusion induced Cr-Mo-Nb based boride precipitation was observed in DAZ. ► Boride precipitates in DAZ influence the corrosion resistance and aging behavior.