کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1617387 1005685 2011 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In
چکیده انگلیسی

Sn–Cu alloys have been considered as a candidate for high temperature lead-free microelectronic solders. In the present study, the change in microstructure, attenuation and elastic behavior associated with alloying of Ag and/or In into the eutectic Sn–Cu solder alloy system have been evaluated. The study involved measurements of longitudinal and shear wave velocities, attenuation, hardness, bulk and shear moduli, Young's and Poisson's ratio. The results of attenuation show that a clear attenuating effect in the ternary Sn–Cu–Ag and Sn–Cu–In alloys is realized, whereas the quaternary Sn–Cu–Ag–In solder displays an obscure attenuating effect. The obscure effect is mainly attributed to the competition for In between Sn and Ag, which results in weak interface formed between intermetallic compounds (IMCs) and β-Sn matrix. Likewise, Poisson's ratio results indicate that its value decreases with increasing the elastic moduli and ultrasonic velocities of Ag and In-containing alloys. The analyzed enhanced ductility of Sn–0.7Cu and Sn–0.7Cu–2In alloys and brittleness of Sn–0.7Cu–2Ag and Sn–0.7Cu–2Ag–2In alloys were rationalized on the basis of Poisson's ratio and the quotient of shear modulus to bulk modulus (Pugh's ratio). Microstructural analysis revealed that the origin of change in the elastic properties of the ternary and quaternary alloys is ascribed to smaller β-Sn dendrite grain dimensions and formation of new IMCs in the ternary and quaternary alloys.

Research highlights▶ We investigated the structural and elastic properties of Sn–0.7Cu-based solders containing small amount of Ag and In elements. ▶ Additions of Ag and In will decrease the β-Sn dendrite grain dimensions and form new intermetallic compounds (IMCs). ▶ Additions of Ag or In will increase the hardness, attenuation coefficient, shear and Young's moduli, and decrease the Poisson's ratio. ▶ The change in the elastic properties of ternary and quaternary alloys depends on the change in microstructure.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 509, Issue 26, 30 June 2011, Pages 7238–7246
نویسندگان
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