کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1618764 1516383 2010 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Mechanical alloying synthesis and soldering microstructures of nanocrystalline Sn–3.5Ag–0.7Cu alloy powders
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
Mechanical alloying synthesis and soldering microstructures of nanocrystalline Sn–3.5Ag–0.7Cu alloy powders
چکیده انگلیسی

Nanocrystalline Sn–3.5Ag–0.7Cu alloy powders were successfully fabricated by mechanical alloying (MA). During MA, Sn, Ag and Cu powders were deformed, overlapped and cold-welded together to form lamellar composites. The lamellar composites were then transformed into equiaxial particles. The milled powders were composed of a supersaturated solid solution, named Sn(Ag, Cu), and intermetallic compounds (IMCs) of Ag3Sn and Cu6Sn5. The average particle size (D4,3) and the melting point of the 60 h milled Sn–3.5Ag–0.7Cu powders were 19.9 μm, and 219 °C, respectively. After melting the powders on a Cu substrate at 260 °C, a dense solder was formed, consisting of a hypereutectic structure of oval shaped primary β-Sn and eutectic products of β-Sn, Cu6Sn5, and Ag3Sn. Meanwhile, the Ag3Sn laths at the solder/Cu6Sn5 layer interface and the coarse Cu6Sn5 plates in the solder were also detected.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 497, Issues 1–2, 14 May 2010, Pages 396–401
نویسندگان
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