کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1620244 | 1005731 | 2010 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Revisiting mechanisms to inhibit Ag3Sn plates in Sn-Ag-Cu solders with 1Â wt.% Zn addition
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Revisiting mechanisms to inhibit Ag3Sn plates in Sn-Ag-Cu solders with 1Â wt.% Zn addition Revisiting mechanisms to inhibit Ag3Sn plates in Sn-Ag-Cu solders with 1Â wt.% Zn addition](/preview/png/1620244.png)
چکیده انگلیسی
Two mechanisms to inhibit Ag3Sn plates were discovered in Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu with 1 wt.% Zn addition. It was revealed that 1 wt.% Zn not only reduced the supercooling of β-Sn, but also promoted the formation of γ-(Cu,Ag)5Zn8 compounds. The amount of γ-(Cu,Ag)5Zn8 was larger in Sn-3.0Ag-0.5Cu than that in Sn-1.0Ag-0.5Cu. Meanwhile, the Ag content in γ-(Cu,Ag)5Zn8 was higher in the high-Ag solder. Although more γ particles formed under slow cooling rate, the Ag content varied a little with cooling rate.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 500, Issue 1, 18 June 2010, Pages 39-45
Journal: Journal of Alloys and Compounds - Volume 500, Issue 1, 18 June 2010, Pages 39-45
نویسندگان
Z.-B. Luo, J. Zhao, Y.-J. Gao, L. Wang,