کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
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1622075 | 1516392 | 2009 | 6 صفحه PDF | دانلود رایگان |

Reflow reactions of the Au–20 wt.% Sn (Au20Sn) solder on the Cu substrate at 330 °C were conducted and the microstructure of as-solidified solder joint was examined. After reflow for 1 min, the as-solidified solder matrix presented a typical eutectic ζ-(Au,Cu)5Sn + δ-(Au,Cu)Sn lamellar microstructure and two phases, ζ-(Au,Cu)5Sn and AuCu, were formed at the solder/Cu interface. The ζ-(Au,Cu)5Sn phase grew very irregularly at the interface. Upon increasing the reflow time, part of the fine lamellar microstructure coarsened in the as-solidified solder matrix, and therefore the solder matrix displayed a composite microstructure of fine lamellar eutectic and coarse eutectic. In addition, dendritic growth of the ζ-(Au,Cu)5Sn phase was observed and the ζ dendrites were found to grow at a faster rate in the solder matrix of smaller volume. The microstructural evolution at the Au20Sn/Cu solder joint during reflow, including irregular growth of ζ-(Au,Cu)5Sn at the interface, dendritic growth of ζ-(Au,Cu)5Sn in the solder matrix, and development of eutectic microstructure, was explained using related phase diagram and vertical section.
Journal: Journal of Alloys and Compounds - Volume 485, Issues 1–2, 19 October 2009, Pages 219–224