Annealing Ni nanocrystalline on WC-Co

Atomic force microscopy shows that high annealing temperature results into an exponential increase of the roughness. An intermixing between the nanocrystalline Ni and the Co from WC substrate occurs, as it is revealed by quantitative depth-resolved Rutherford backscattering spectrometry analysis and also supported by X-ray photoelectron spectroscopy. We ascribe a significant stress relief with the increasing annealing temperature to the diffusion process. The understanding of this process is particularly important in WC-Co parts with the surface treated with Ni in order to improve the maximum surface service temperature.