کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1624281 | 1516421 | 2008 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Formation of intermetallic compound (IMC) between Sn and Co substrate
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Formation of intermetallic compound (IMC) between Sn and Co substrate Formation of intermetallic compound (IMC) between Sn and Co substrate](/preview/png/1624281.png)
چکیده انگلیسی
Interfacial reactions between pure Sn and Co at different temperatures were investigated by using EPMA. Different intermetallic compounds were detected in the reaction couples. CoSn2 was formed at 673 and 773 K while CoSn appeared at 873 K in the Sn/Co couples. In order to illuminate the formation mechanism of the intermetallic compounds, the driving force of nucleation, relative stability and Co diffusion through the interface have been taken into account. Consequently, the formation of intermetallic compounds through interfacial reactions has been explained.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 456, Issues 1–2, 29 May 2008, Pages 113–117
Journal: Journal of Alloys and Compounds - Volume 456, Issues 1–2, 29 May 2008, Pages 113–117
نویسندگان
WenJun Zhu, HuaShan Liu, Jiang Wang, ZhanPeng Jin,