Formation of intermetallic compound (IMC) between Sn and Co substrate

Interfacial reactions between pure Sn and Co at different temperatures were investigated by using EPMA. Different intermetallic compounds were detected in the reaction couples. CoSn2 was formed at 673 and 773 K while CoSn appeared at 873 K in the Sn/Co couples. In order to illuminate the formation mechanism of the intermetallic compounds, the driving force of nucleation, relative stability and Co diffusion through the interface have been taken into account. Consequently, the formation of intermetallic compounds through interfacial reactions has been explained.