کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1624609 | 1516422 | 2008 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Interfacial reaction between Sn–Ag alloys and Ni substrate
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Interfacial reaction between Sn–Ag alloys and Ni substrate Interfacial reaction between Sn–Ag alloys and Ni substrate](/preview/png/1624609.png)
چکیده انگلیسی
Interfacial reactions between different compositional Sn–Ag alloys and Ni substrate at 493 K for different durations were investigated. Only one intermetallic compound (IMC), Ni3Sn4, was detected at the interface. This result was attributed to combining effects of driving force for the IMC formation and diffusion of Ni across the interface. Furthermore, it was found that the growth of Ni3Sn4 layer at the interface with annealing time obeys a parabolic rule, which implies a diffusion-controlled mechanism. In addition, the thickness of Ni3Sn4 layer decreases with increasing Ag content in the Sn–Ag alloys.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 455, Issues 1–2, 8 May 2008, Pages 159–163
Journal: Journal of Alloys and Compounds - Volume 455, Issues 1–2, 8 May 2008, Pages 159–163
نویسندگان
J. Wang, L.G. Zhang, H.S. Liu, L.B. Liu, Z.P. Jin,