Effect of structure transformation on the creep characteristics of Sn-3Â wt% Bi alloy

This study details the transient and steady state creep characteristics of Sn-3 wt% Bi alloy as a function of applied stress and testing temperature. The observed results indicated that a transition in the creep behavior occurs at a testing temperature ∼330 K. The activation energy of the transient creep amounted to 19 and 31 kJ/mol before and after the transition testing temperature, due to both glide of dislocations and cross-slipping dislocation mechanism, respectively. The activation energy of the steady state creep in the vicinity of the transition and above the transition testing temperature were found to be 39 and 48 kJ/mol as characteristic of the grain boundary sliding mechanism.