کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1660650 1008408 2008 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Optimisation of process parameters for electroless plating of Co–W–P capping layers from an alkali-metal-free bath
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
Optimisation of process parameters for electroless plating of Co–W–P capping layers from an alkali-metal-free bath
چکیده انگلیسی

Co–W–P thin films were electrolessly deposited on a copper-coated silicon wafer from an alkali-metal-free bath and the effects of pH, temperature and hydrodynamic condition of the electrolyte on the composition, thickness and microstructure of the films were investigated. Compositional analyses using X-ray photoelectron spectroscopy revealed that the surface of the films contained large amounts of hydroxide of cobalt and oxides of cobalt and tungsten. The bulk of the films, however, consisted predominantly of elemental cobalt, tungsten and phosphorus. It was observed that the cobalt content and the thickness of the films increased with increase in the pH, temperature and stirring rate of the solution. On the other hand, both the tungsten and phosphorus contents in the films decreased with increase in the temperature and stirring rate. Microstructural analysis using X-ray diffraction showed that the deposited films were crystalline and contained hexagonal cobalt with a preferred crystallographic orientation of [002]. The grain size of the deposit increased with increase in the pH, temperature and stirring rate of the electrolyte. Scanning electron microscopic examination showed that the deposited films had typical spherical nodular structures with good coverage.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 202, Issue 19, 25 June 2008, Pages 4861–4867
نویسندگان
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