Processing TiPdNi base thin-film shape memory alloys using ion beam assisted deposition

A new generation of thin-film shape memory alloys (SMA) has been developed with less than 2 μm thickness for MEMS microactuator applications. In this study, thin-film TiPdNi SMA was processed using ion beam assisted deposition (IBAD) with and without in situ heat treatment. As-deposited films were found to be amorphous. Postdeposition annealing lead to bulk diffusion of palladium to the substrate interface and silicon into the bulk film, creating a porous cross section. Various forms of tensile failures were observed including decohesion and delamination as a result of postdeposition annealing. Effect of heating and cooling rates was studied as well as in situ heat treatment during deposition. Deposition using the IBAD technique with in situ heat treatment was successful in producing fully martensitic films 1.5 μm thick and with reduced grain size and film defects, compared to the other sputter deposited films and IBAD deposited followed by postdeposition heat treatment. The effects of various processing parameters, and heat treatment conditions, on film properties have been studied.