Numerical analysis of electrodeposition in microcavities

Electrodeposition in sacrificial polymeric micromolds is an important step in processes such as LIGA, an acronym for the German words for lithography, electroforming and molding, for fabricating metallic microstructures. This paper investigates electrodeposition in microcavities with a conducting base and plastic features that provide insulating sidewalls for fabrication of the desired metallic micropart. Computational models for the governing transport and electrochemical phenomena are used to simulate the evolution of the electrodeposition front and the spatial current density profiles with time. The effects of the applied voltage and micromold geometry are systematically studied for their influence on the resulting electrodeposition rate and uniformity of the deposition front. Conditions that lead to desirable process and part quality are derived from the studies.

► Presents a comprehensive numerical study on electrodeposition in microcavities.
► Analyzes the effects of microcavity and bath geometry and voltage on electrodeposition.
► Presents optimum process design for minimizing fill time and overplating.