کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
190004 459691 2010 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
A modified Damascene electrodeposition process for bottom-up filling of recessed surface features
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی مهندسی شیمی (عمومی)
پیش نمایش صفحه اول مقاله
A modified Damascene electrodeposition process for bottom-up filling of recessed surface features
چکیده انگلیسی

A modification of the conventional Damascene metallization process is described whereby selective removal of the thin wetting/seed layer from the sidewalls and free surfaces enables selective nucleation and bottom-up electrodeposition of metals and alloys in recessed surface features. The process is demonstrated by filling sub-micrometer trenches with electrodeposited Ni. A conventional PVD Cu seed layer is etched to remove Cu from the sidewalls and free surface while leaving a continuous Cu wetting layer intact on the trench bottom. The underlying non-wetting barrier layer provides a conductive path for electrodeposition from contacts on the perimeter of the work piece to the trench bottom. The robustness of the bottom-up Ni electrodeposition process is greatly increased by the addition of 2-mercaptobenzimidazole (MBI) to the plating bath. The additive hinders spurious nucleation of Ni on residual Cu patches that may remain on the free surface.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Electrochimica Acta - Volume 55, Issue 28, 1 December 2010, Pages 8527–8531
نویسندگان
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