کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
190640 459703 2010 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Copper deposition and its replacement by platinum on a gold electrode
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی مهندسی شیمی (عمومی)
پیش نمایش صفحه اول مقاله
Copper deposition and its replacement by platinum on a gold electrode
چکیده انگلیسی

The decoration of single crystal gold electrodes with platinum using underpotential deposited copper as an intermediate has been studied in detail. It was found that a significant fraction of the copper is lost in the transfer process from the upd cell to the exchange cell. In addition the surface of the gold is not covered uniformly by the platinum. Nevertheless, acceleration of the electroreduction of oxygen was observed with a loading of 0.14 μg cm−2. The structure of the decorating layer was studied by scanning electron microscopy and atomic force microscopy.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Electrochimica Acta - Volume 55, Issue 26, 1 November 2010, Pages 7610–7614
نویسندگان
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