In-situ investigation of the interplay between microstructure and anodic copper dissolution under near-ECM conditions – Part 1: The active state

The influence of crystallographic orientation on the anodic dissolution of copper in sodium nitrate under near ECM conditions was investigated in situ by a specially designed electrochemical flow channel cell. The investigation was limited to the active dissolution range where a distinctive influence of the microstructure on the anodic dissolution was expected. It was clearly shown that the topography strongly depends on the crystallographic orientation. The dissolution rate of less-packed {1 0 0} planes is higher than of the close-packed {1 1 1} planes. Additionally, a gas evolution as side reaction was temporarily observed. This process happens preferentially on {1 1 1} planes.

► The anodic dissolution of copper under near ECM conditions was investigated in situ.
► The dissolution process is strongly influenced by the crystallographic orientation of copper.
► Oxygen evolution was observed as temporary process which decreases over the time of experiment and is only observed in every first pulse.
► Oxygen evolution seems to be preferentially on grains vicinal to {1 1 1}.