Simulation of electrochemical nucleation in the presence of additives under galvanostatic and pulsed plating conditions

Galvanostatic nucleation of copper onto pretreated ruthenium is investigated using experimental methods and numerical simulations in the presence of two different suppressor molecules; polyethylene glycol (PEG) and ethylene glycol–propylene glycol–ethylene glycol block copolymer (EPE). The model parameters have been largely determined from electrochemical characterization. Results suggest that a fast adsorption rate of the suppressor results in higher nucleus densities. Simulation results provide insight why EPE is more effective than PEG at increasing nucleus density. In addition, the simulations are used to predict the impact of pulse plating paramaters, showing that both the properties of the additive and the waveform need to be considered to optimize nucleus density enhancement.