Effect of triethanolamine and heliotropin on cathodic polarization of weakly acidic baths and properties of Sn–Ag–Cu alloy electrodeposits

The effect of triethanolamine (TEA) and heliotropin (HT) on the cathodic polarization of weakly acidic baths and the properties of Sn–Ag–Cu alloy electrodeposits were investigated. Lead-free Sn–Ag–Cu solder alloy were electrodeposited in weakly acidic baths (pH 5.5) containing Sn(CH3SO3)2, AgI, Cu(CH3SO3)2, K4P2O7, KI, hydroquinone, TEA, HT and methylsulfonic acid (MSA). The cathodic polarization of baths and the properties of electrodeposits were evaluated by Liner sweep voltammetry (LSV), scanning electron microscopy (SEM), X-ray fluorescence (XRF), X-ray diffraction (XRD), Fourier transform infrared spectrometer (FT-IR) and X-ray photoelectron spectroscopy (XPS). The results indicate that HT is a main brightening agent that increases the cathodic polarization of baths and refines the grains of electrodeposits; TEA is a complexing agent for copper ions and a brightening promoter that decreases the cathodic polarization of baths and densifies the electrodeposits. The bright, compact, and smooth Sn–Ag–Cu alloy electrodeposits contain 88–95 wt% tin, 5–10 wt% silver and 0.5–2 wt% copper. Organic compounds used in the baths neither adsorb on the electrodeposits surfaces nor are included in the electrodeposits. It can be therefore concluded that the use of both TEA and HT is better than that of them either in the process of electroplating bright Sn–Ag–Cu alloy.