Codeposition of copper and tin from acid sulphate solutions containing polyether sintanol DS-10 and micromolar amounts of halides

Cu(II) and Sn(II) reduction in acid sulphate solutions containing polyether laprol DS-10 was investigated using voltammetric XPS and XRD techniques. Bright yellow bronze coatings can be deposited at potentials (E  ) that are positive than equilibrium potential (EeqSn) of Sn|Sn2+ electrode. Here, Sn(II) reduction might be treated as underpotential deposition (UPD) of tin on foreign (copper) substrate. Further incorporation of tin into integral Cu–Sn crystallic lattice yields the mixture of pure copper, α-CuSn phase and intermediate hexagonal hcp phase. The formation of free tin phase occurs at E