Influence of a cationic surfactant in the properties of cobalt–nickel electrodeposits

The effect of a cationic surfactant, dodecyltrimethylammonium chloride (DTAC) on CoNi electrodeposition process has been analysed. CoNi electrodeposition is greatly modified by the presence of the cationic surfactant in the bath. The DTAC modifies the initial stages of the deposition process and enhances the cobalt percentage in the deposits. Structure and morphology of the deposits are also modified, as the manner that magnetic properties of the electrodeposited films were affected as a consequence of the structural change. The presence of the surfactant in the bath causes changes on the CoNi structure from face-centred cubic (fcc) to close-packed hexagonal (hcp). DTAC incorporation into the deposits is a function of its concentration in the bath. Thus, it is important to be careful with the effects caused by the surfactant on deposits when it assists the particles insertion.