کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
195603 | 459818 | 2006 | 11 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A model for copper deposition in the damascene process
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
مهندسی شیمی (عمومی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Copper deposition in a plating bath known to fill narrow trenches was studied on a rotating disc electrode by impedance measurements. The chemistry of this bath contained, in addition to sulphuric acid, copper sulphate and chloride ions, polyethylene glycol (PEG) as an inhibitor and 3-mercapto-1-propanesulfonate, sodium salt (MPSA) as an accelerator. The experimental results were compared with a model taking into account these organic additives. A competitive adsorption of two complexes: PEG–Cl–CuI and CuISPS formed from Cu+ and the additives, is proposed. A good agreement was shown between this model and the experiments on fresh plating bathes.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Electrochimica Acta - Volume 51, Issues 8–9, 20 January 2006, Pages 1462–1472
Journal: Electrochimica Acta - Volume 51, Issues 8–9, 20 January 2006, Pages 1462–1472
نویسندگان
C. Gabrielli, P. Moçotéguy, H. Perrot, D. Nieto-Sanz, A. Zdunek,