کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
196476 | 459842 | 2006 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Mechanism of copper electrodeposition in the presence of picolinic acid
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
مهندسی شیمی (عمومی)
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چکیده انگلیسی
The influence of picolinic acid (PA) on copper deposition from a slightly acidic sodium sulphate electrolyte has been studied over a wide range of concentration and pH by cyclic voltammetry. The mechanism by which the copper electrodeposition process in the presence of PA takes place, depends on the chemistry and electrochemistry characteristics of the additive. Depending on the PA concentration and pH of the solution, five different cathodic current peaks are obtained, which are assigned to different steps involving copper deposition from free-Cu2+ ions and [Cu(PA)n]2+ complex species as well as H+ ions electroeduction. Fine-grained, highly adherent and bright copper deposits were obtained.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Electrochimica Acta - Volume 51, Issue 16, 10 April 2006, Pages 3261–3268
Journal: Electrochimica Acta - Volume 51, Issue 16, 10 April 2006, Pages 3261–3268
نویسندگان
Ana L. Portela, Manuel López Teijelo, Gabriela I. Lacconi,