کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
4516566 | 1322362 | 2008 | 12 صفحه PDF | دانلود رایگان |
![عکس صفحه اول مقاله: Dynamic viscoelastic, calorimetric and dielectric characteristics of wheat protein isolates Dynamic viscoelastic, calorimetric and dielectric characteristics of wheat protein isolates](/preview/png/4516566.png)
Dynamic oscillatory rheology of two wheat protein isolate (Prolite 100 and Prolite 200) doughs (≈48% moisture content, wet basis) were studied over a frequency range of 0.1–10 Hz during temperature sweep from 20 to 90 °C at a heating rate of 2 °C/min. Both doughs behaved similarly during heating; showed a threshold value and increased sharply, thereafter. Prolite 200 dough had a higher elastic modulus (G′) and lower phase angle (δ) whereas Prolite 100 showed a distinct gel point at 52.2 °C followed by significant increase up to 90 °C. Rheological data of doughs after isothermal heating at 90 °C for 15 min followed by cooling to 20 °C resulted in strong mechanical strength. However, Prolite 100 dough showed more viscoelastic characteristics with significant transformation from liquid-like to solid-like behavior after heating than Prolite 200. Thermal analysis of isolates indicated distinct endothermic peaks in wider temperature range (50–130 °C) at various moisture levels. Lower temperatures could be associated with denaturation of various fractions of proteins whereas higher temperature linked to glass transition temperature of isolates. SDS–PAGE did not show any clear distinction among protein subunits between two isolates. Dielectric measurements of isolates at frequencies from 500 to 3000 MHz and temperature range between 30 and 80 °C indicated Prolite 200 had higher dielectric constant (ε′) and loss factor (ε″) than Prolite 100. Isolates showed significant changes in dielectric properties above 50 °C indicating protein denaturation and supported rheological and calorimetric data.
Journal: Journal of Cereal Science - Volume 47, Issue 3, May 2008, Pages 417–428