Influence of additives on Cu thin films electrodeposited directly on Ti diffusion barrier in Cl−-free electrolytes for Cu interconnect

Influence of additives on Cu thin films electrodeposited directly on Ti diffusion barrier in Cl−-free electrolytes for Cu interconnect

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 172, 25 March 2017, Pages 8-12

Byoungyong Im, Sunjung Kim,