کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
4990487 1457106 2017 10 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Heat dissipation of high-power light emitting diode chip on board by a novel flat plate heat pipe
ترجمه فارسی عنوان
از بین بردن گرما از تراشه دیود با قدرت بالا بر روی هیئت مدیره توسط یک لوله گرمایش جدید لوله مسطح
کلمات کلیدی
لوله گرمایش ورق تخت، دیود ساطع نور، خنک کننده الکترونیک، اتلاف حرارت، تراشه در هیئت مدیره
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی جریان سیال و فرایندهای انتقال
چکیده انگلیسی
A new flat plate heat pipe (FPHP) which has many parallel-arranged micro-fins casted on the condensation surface was designed and fabricated. An experimental system for studying the thermal performance of this FPHP when applied for cooling high-power LED (light emitting diode) COBs (chip on board) was also set up. From experiments, the new FPHP is found to be more effective for heat dissipation of high-power LED COBs than the traditional FPHP. The thermal resistance of the new FPHP is 10-15% lowered and the temperature uniformity at the condensation surface of FPHP is approximately at the same level in comparison with the traditional FPHP. Numerical simulation with respect to LED COB cooling by the new FPHP was performed additionally. The obtained simulation results accord well with the experimental results, inter-proving the reliability of the obtained results and further corroborating the effectiveness of the new FPHP as applied for heat dissipation of high-power LED COBs.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Thermal Engineering - Volume 123, August 2017, Pages 19-28
نویسندگان
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