کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5191894 | 1381242 | 2005 | 16 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Deformation-morphology correlations in electrically conductive carbon nanotube-thermoplastic polyurethane nanocomposites
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی آلی
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Deformation-morphology correlations in electrically conductive carbon nanotube-thermoplastic polyurethane nanocomposites Deformation-morphology correlations in electrically conductive carbon nanotube-thermoplastic polyurethane nanocomposites](/preview/png/5191894.png)
چکیده انگلیسی
Addition of small amounts (0.5-10Â vol%) of multiwall carbon nanotubes (CNT) to thermoplastic elastomer Morthane produced polymer nanocomposites with high electrical conductivity (Ïâ¼1-10Â S/cm), low electrical percolation (Ïâ¼0.005) and enhancement of mechanical properties including increased modulus and yield stress without loss of the ability to stretch the elastomer above 1000% before rupture. In situ X-ray scattering during deformation indicated that these mechanical enhancements arise not only from the CNTs, but also from their impact on soft-segment crystallization. The deformation behavior after yielding of the nanocomposites, irrespective of CNT concentration, is similar to the unfilled elastomer, implying that the mechanistics of large deformation is mainly governed by the matrix. The relative enhancement of the Young's modulus of the nanocomposites is comparable to other elastomeric nanocomposites, implying that to the first order specific chemical details of the elastomeric system is unimportant.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Polymer - Volume 46, Issue 12, 26 May 2005, Pages 4405-4420
Journal: Polymer - Volume 46, Issue 12, 26 May 2005, Pages 4405-4420
نویسندگان
Hilmar Koerner, Weidong Liu, Max Alexander, Peter Mirau, Heather Dowty, Richard A. Vaia,