کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
539404 1450358 2014 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Stamp design towards instability-induced 3D patterning
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Stamp design towards instability-induced 3D patterning
چکیده انگلیسی


• 5 μm high polymeric bridges induced by a temperature difference.
• Silica particles as spacers between stamp and substrate.
• Rough estimation of mechanical properties of silica particles.

Instability-induced pattern formation is easily realized during thermal nanoimprint when a temperature difference is provided between stamp and substrate. The use of this effect for pattern definition requires spacers between stamp and substrate to install a gap of definite height. We test the use of silica particles to serve as spacers with variable height for such an approach. Then, there is no need to prepare stamps with a specific design especially for this purpose, as any stamp available can be used. It turns out that the silica particles are not ideally suited to serve as reliable spacers – they are too soft, when Si stamps are used, but too hard when replica stamps made from OrmoStamp are used. The experiments allow to roughly estimate the mechanical properties of the particles. Nonetheless, it is demonstrated that a formation of isolated polymeric bridges of 5 μm in height is feasible.

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ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 123, 1 July 2014, Pages 100–104
نویسندگان
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