کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
539421 1450358 2014 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Measurements of flow distribution in a thin resin layer during ultraviolet nanoimprint lithography by means of digital holographic particle-tracking velocimetry
ترجمه فارسی عنوان
اندازه گیری توزیع جریان در یک لایه رزین نازک در طول لیتوگرافی نانویمترنت ماوراء بنفش با استفاده از دقت سنجی ردیابی ذرات هولوگرافی دیجیتال
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
چکیده انگلیسی


• Micro-DHPTV was used to measure an UV-curable resin flow at in situ NIL process.
• We succeeded in measuring the 4-dimensions flow distribution in the thin resin layer.
• It was clearly shown that the presence of a release agent affects the UV-curable resin flow.
• We believe this study will provide a better understanding of the flow behavior of UV-curable resins.

There is an urgent need for micro- and nano-scale patterning methods with a high throughput and cost-effective process for the manufacture of devices of the next generation. Ultraviolet nanoimprint lithography (UV-NIL) represents a major breakthrough for next-generation lithography because of its higher resolution and greater simplicity compared with conventional technologies. However, transfer defects such as bubble defects or filling failures in the UV-NIL process have been problematic, because UV-NIL is a contact-type method. Therefore, it is important to elucidate the behavior of UV-curable resin flowing to permit control over defects in the duplicated pattern. In this study, we succeeded in measuring the flow distribution of a thin layer of UV-curable resin in situ during the press process of UV-NIL by means of microscale digital holographic particle-tracking velocimetry, and we clearly showed that a release agent coated onto the nanoimprint mold affects the resin flow. We believe that this study will help to provide a better understanding of the behavior of UV-NIL.

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ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 123, 1 July 2014, Pages 187–191
نویسندگان
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